IMSE®

In-Mold Structural Electronics

We are collaborating with the Finnish company TACTOTEK to drive forward innovation in IMSE®-based engineering services.

Together with our strengths in mechanical engineering, lightweight construction, lighting and electronics, TACTOTEK's IMSE® technology is setting new standards in design, functional integration, weight reduction and, ultimately, sustainability.

IMSE (In-Mold Structural Electronics®) manufacturing technology enables innovative HMI (Human Machine Interface) solutions to be produced for a wide range of industries. IMSE® is the perfect blend of form and function, combining printed conductive inks with In-Mold Decoration (IMD) to create a complete HMI solution in a single component. IMSE® solutions make product assembly easier and faster, are lighter and more resistant to damage, reduce the bill of materials, and ultimately lower the total cost of ownership. They are based on proven processes and technologies and significant competitive advantages to manufacturers in all sectors.

 

Sven Kübler
Sven Kübler

Head of Interior

Ultralight structures for state-of-the-art applications
 

IMSE® stands for “In-Mould Structural Electronics”, that is ultra-thin, lightweight structures with integrated electronics. IMSE® was developed by the Finnish high-tech company TactoTek. As a licensed partner, we are pleased to be able to use this technology in interior as well as in exterior. It enables us to overcome the limits of mechanical design. The process makes it possible to print electronics or conductive materials and circuits directly onto plastic films, which are then formed in a three-dimensional process or incorporated into plastic components.

Conventional electronic elements compared to an IMSE component

even under the surface

Beautifully printed circuits and electronic components can perform their functions in 3D injection-molded plastics.

DESIGN WITHOUT LIMITS.

Looks really good ...

Beautifully printed circuits and electronic components can perform their functions in 3D injection-molded plastics.

DESIGN WITHOUT COMPROMISE.

Revolutionary design possibilities with IMSE® technology

The integration of printed circuits and discrete electronic components into 3D injection-moulded plastics enables seamless structures to be produced. Where previously complex, multi-part assemblies were required, IMSE now offers a slimmer, one-piece and design-orientated solution that is also easier to assemble. This development offers engineers and designers new freedoms and possibilities. It allows them to develop innovative solutions and trends, thereby distinguishing themselves in the market.

Turn any 3D surface into a control panel

Integrate electrical functions wherever you need them. Choose from various surfaces such as plastic, glass, veneer, or leather, and use lighting to create static or dynamic accents.

The cutting-edge solution for versatile industrial applications

IMSE®'s ability to enable advanced features makes the technology attractive to companies in a wide range of industries looking to offer hardware-as-a-service. Given its small size, we firmly believe that IMSE® will not just play a decisive role in vehicle interiors. 
Other possible applications include aviation, shipbuilding, household appliances, the manufacturing industry and wherever the benefits of IMSE® solutions can be used.

Advantages of IMSE®
 

  • Unique, flexible design
  • Small size and lighter weight
  • Fewer parts, fewer tools, reduced inventory
  • Minimal assembly
  • Low operating costs
  • Reliable capacitive switch as there are no moving parts
  • Thin and lightweight control panel
  • One injection-moulded part with IMSE® SiP
  • One injection mould
  • No gaps where dirt and bacteria can hide
  • More environmentally- friendly manufacturing process, e.g. due to less waste

ANSWERS TO FREQUENTLY ASKED QUESTIONS

In order to master the interdisciplinary requirements of IMSE® projects, we rely on specialized tools: In the 2D/3D CAD area, we work with Catia V5, Fab3000 and Corel Draw. The electrical and electronic design is done via Altium Designer including Analyzer Extension, while we use LS-DYNA for demanding thermal simulations. Project management is controlled transparently via JIRA.

The technology is suitable wherever aesthetics, functional integration and weight reduction are required – e.g. in aviation, shipbuilding, medical technology, the household appliance industry and the manufacturing industry.

csi combines IMSE® with its expertise in mechanics, lightweight construction, lighting and electronics to create a holistic approach. Ideally, customers involve us in the early concept phase in order to jointly define the range of functions, design goals and technological boundary conditions. From the initial concept idea to digital prototypes and simulations to series development and industrialization with partners, we accompany the entire process. Systems Engineering takes over the central control function to ensure that IMSE®® components are seamlessly integrated into the overall vehicle.

By replacing classic, mechanical assemblies with integrated structural electronics. Such components are lighter, more space-saving and more durable than conventional HMI alternatives. They reduce the number of individual parts, simplify assembly and thus lower the overall costs. At the same time, they enable advanced functions such as capacitive controls, dynamic lighting and hardware-as-a-service – i.e. the temporary activation of additional functions. Another key advantage is the enormous design freedom with which "smart, thin, seamless" surfaces can be realized.

Through technologies such as IMSE,® for which a height of 4.5 to 6 millimeters is sufficient. This means that almost any surface in instrument panels, trim strips or door panels can be illuminated, turned into a control element or switch, without sacrificing aesthetics or haptics. IMSE® enables completely new user interfaces, such as gesture control via integrated sensors and two-dimensional interaction concepts. The technology is not limited to vehicle interiors, but is also suitable for exterior applications as well as other industries such as aerospace, medical technology and consumer electronics.

A very innovative solution for this is the In-Mold Structural Electronics (IMSE)® technology. Printed circuits and electronic components are integrated directly into 3D injection molded plastics. What previously consisted of dozens of individual parts becomes a single, slim component (integration instead of assemblies) – lighter, more compact, much more robust and easier to assemble. In addition, the technology promotes sustainability through lower material use and reduced complexity.

csi is a licensed development partner of TactoTek – the Finnish company that developed IMSE®. As one of the few licensed development service providers worldwide, csi has the necessary IP and know-how for design, simulation and series development with IMSE.® In addition, we are characterized by extremely strong system integration, in which we precisely combine the specific requirements of OEMs with the new technological possibilities.